Alumni Enterprise Chuangda Advanced Materials Listed on the Beijing Stock Exchange

Recently, Wuxi Chuangda Advanced Materials Co., Ltd. (Stock code: 920012), an alumni enterprise, was officially listed on the Beijing Stock Exchange.

On the eve of its listing, Chuangda Advanced Materials held a thank-you reception. Chuanhai Jiang, Secretary of the CPC ECUST Committee, attended the reception and delivered a speech. He extended warm congratulations to alumnus Jun Zhang and Chuangda Advanced Materials. He also expressed the hope that ECUST would join hands with Chuangda Advanced Materials and all other alumni enterprises to further deepen the integration of industry and education, jointly build innovation platforms, cultivate top-tier talents, and make contribution to China’s high-quality development.

At the ceremony, remarks were delivered by Jun Zhang, Chairman and General Manager of the enterprise; Haifeng Yan, Vice President of ECUST; Mingxi Wang, General Manager of Shenwan Hongyuan Securities Underwriting & Sponsorship Co., Ltd., the sponsoring institution; and Zhejun Hu, General Manager of Runke Investment Management (Shanghai) Co., Ltd., representing the investment institutions.

Chuangda Advanced Materials is a high-tech enterprise with over two decades of expertise in high-performance thermoset composite materials, and was listed among the seventh batch of national-level specialized, refined, distinctive, and innovative enterprises in 2025. 

The founder is Jun Zhang, an alumnus from the Class of 1987 majoring in Chemical Engineering at ECUST. In addition, among the co-founders, Wei Huang, Huobao Chen, and Genyuan Weng are alumni from the Class of 1986, 1987, and 1989, respectively.

The enterprise’s core focuses on high-performance thermosetting resin-based composite materials, a strategic emerging industry encouraged by the state, with a primary emphasis on electronic packaging materials. It has established a diverse product matrix ranging from solid molding compounds to liquid encapsulants. 

Core products include epoxy molding compounds, liquid epoxy encapsulants, silicone rubbers, phenolic molding compounds, and conductive silver adhesives. These products are widely used in the packaging processes of semiconductors, automotive electronics, and various electronic appliances, providing customers with one-stop and integrated packaging material solutions.